Chip-Scale Quantum Optics: Overcoming Challenges to Unlock Market Potential

Integrating quantum optical building blocks at the chip level paves the way for bringing the benefits of quantum optics to the consumer market, enabling advancements such as ultra-secure communication, high-precision sensing, faster AI processing, and next-generation medical diagnostics in everyday applications. With the quantum technology market projected to reach billions in value over the coming years, scalable on-chip solutions will be key to driving widespread adoption and commercialization.

However, integrating quantum optical components at this scale presents significant challenges in material selection and fabrication, requiring high-purity materials, precise nanofabrication techniques, and seamless integration with existing semiconductor technologies to maintain quantum coherence and efficiency. PIC activities at Fraunhofer IOF strategically address these challenges, beginning with precise calculations of waveguide coupled mode dynamics, followed by component development and layout design, and culminating in high-precision fabrication within a 300 nm cleanroom environment.

The talk will explore solution approaches for enabling the preparation and modulation of quantum states of light through advancements in modern materials science and nanotechnology. Specifically, we will focus on devices for the generation and modulation of signal and idler photons with different frequencies and polarizations within CMOS-compatible platform technologies such as Silicon Nitride (Si3N4), Lithium Niobate (LiNbO3) and Barium Titanate (BaTiO₃).

Presentation language: EN